Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

散渗锌作为上世纪初发展起来的一项金属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀金层是镀后在加熔融处理程中通散在基与层之间生成的一种金属间化物,因此,金层的生成与原和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属表面处理技术,以其良好的耐腐蚀性而得应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀合金层是镀后在加熔融处理过程中通过扩散在基层之间生成的一种金属间化合物,因此,合金层的生成原和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

散渗锌作为上世纪初发展起来的一项金属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀金层是镀后在加熔融处理程中通散在基与层之间生成的一种金属间化物,因此,金层的生成与原和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板是镀锡后在加熔融处理程扩散在基板与锡之间生成的一种属间化物,因此,的生成与原板和镀都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属表面技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

板合金层是在加熔融程中通扩散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来属表面处理技术,以其良好耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合是镀锡后在加熔融处理过程中通过扩散在基板与锡之间成种属间化合物,因此,合成与原板和镀都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属表面处理技术,以其良好的耐腐蚀性而泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀板合金是镀后在加熔融处理过程中通过扩散在基板之间生成的一种金属间化合物,因此,合金的生成原板和镀都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作纪初发展起来的一项金属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金层是镀锡后在加熔融处理过程中通过扩散在基板与锡层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层有大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属表面技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀板合金层是镀加熔过程中通过扩散基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。