Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小散热器对DirectFET封装功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕的液体内酯豆腐加热巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微封装器件上的焊料球质量较小，加上封装体较薄，热量传送器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器DirectFET功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和数据, 衬垫间距, 裂口, 长, 宽, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法肖特基器件后部中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密的表面安器件（SMD）的湿气敏感。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型器件上的焊料球质量较小，加上体较薄，热量传送通过器件速很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

小型散热器对DirectFET封装功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂, , 宽, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后正交试验的法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本于确定非气密封装的表面安装器件（SMD）的湿气敏感等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

于将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密的表面安器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将完毕的液体内酯豆腐加热成型及巴氏。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

于微型器件上的焊料球质量较小，加上体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封，可以通过透明窗观察附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散器对DirectFET封功率MOSFET进行双散(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

和封数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部封中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封的表器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封完毕的液体内酯豆腐加成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封器件上的焊料球质量较小，加上封体较薄，量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合，以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密的表面安器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将完毕的液体内酯豆腐加热成型及巴。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型器件上的焊料球质量较小，加上体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小散热器对DirectFET封装功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕的液体内酯豆腐加热成氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微封装器件上的焊料球质量较小，加上封装体较薄，热量传送器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合装，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

小型散热DirectFET装功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后正交试验的法肖特基件后部装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准于确定非气密装的表面安装件（SMD）的湿气敏感度。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

于将装完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型装件上的焊料球质量较小，加上装体较薄，热量传送通过件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热对DirectFET封装功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装的表面安装件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装件的焊料球质量较小，加封装体较薄，热量传送通过件速度很快。