Melting seal packaging,a transparent window makes the sorbent seeable.
融合封装,可以通过透明窗观察附剂
状态。
Melting seal packaging,a transparent window makes the sorbent seeable.
融合封装,可以通过透明窗观察附剂
状态。
Pavier M.Standing P.Cutler A.Sawle C.Blake A.
用小型散器对DirectFET封装功率MOSFET进行双面散
(M.
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验方法对肖特基器件后部封装
焊工艺进行了参数优化设计。
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
本标准用于确定气密封装
表面安装器件(SMD)
湿气敏感度等级。
Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.
封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少
, 断掉
, 未电镀引线.
It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.
用于将封装完毕液体内酯豆腐加
成型及巴氏灭菌。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上焊料球质量较小,加上封装体较薄,
量传送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件观点;若发现问题,欢迎向我们指正。
Melting seal packaging,a transparent window makes the sorbent seeable.
融合封装,可以通过透明窗观察附剂的状态。
Pavier M.Standing P.Cutler A.Sawle C.Blake A.
用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的艺进行了参数优化设计。
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
本标准用于确定气密封装的表面安装器件(SMD)的湿气敏感度
。
Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.
热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.
It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.
用于将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的料球质量较小,加上封装体较薄,热量传送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Melting seal packaging,a transparent window makes the sorbent seeable.
融合封装,可以通过透明窗观察吸附剂状态。
Pavier M.Standing P.Cutler A.Sawle C.Blake A.
用小型散热器对DirectFET封装功率MOSFET面散热(M.
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验方法对肖特基器件后部封装中
压焊工艺
了参数优化设计。
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
本标准用于确定气密封装
表面安装器件(SMD)
湿气敏感度等级。
Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.
吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少,
, 未电镀引线.
It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.
用于将封装完毕液体内酯豆腐加热成型及巴氏灭菌。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上焊料球质量较小,加上封装体较薄,热量传送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件观点;若发现问题,欢迎向我们指正。
Melting seal packaging,a transparent window makes the sorbent seeable.
融合封装,可以通过透明窗观察吸附剂的状态。
Pavier M.Standing P.Cutler A.Sawle C.Blake A.
小型散热器对DirectFET封装功率MOSFET进行双面散热(M.
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
正交试验的方法对肖特基器件
部封装中的压焊工艺进行了参数优化设计。
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
本标准于确定
气密封装的表面安装器件(SMD)的湿气敏感度等级。
Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.
吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊, 缺少的, 断掉的, 未电镀引线.
It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.
于将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的焊料球质量较小,加上封装体较薄,热量传送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Melting seal packaging,a transparent window makes the sorbent seeable.
融合封装,可以通过透明窗观察吸附剂的状态。
Pavier M.Standing P.Cutler A.Sawle C.Blake A.
用小型散热器对DirectFET封装功率MOSFET进行双散热(M.
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设。
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
准用于确定
气密封装的
装器件(SMD)的湿气敏感度等级。
Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.
吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.
It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.
用于将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的焊料球质量较小,加上封装体较薄,热量传送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其达内容亦不代
软件的观点;若发现问题,欢迎向我们指正。
Melting seal packaging,a transparent window makes the sorbent seeable.
融合封装,可以通过透明窗观察吸附剂的状态。
Pavier M.Standing P.Cutler A.Sawle C.Blake A.
用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最用正交试验的方法对肖特基器件
封装中的压焊工艺进行了参
优化设计。
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
本标准用于确定气密封装的表面安装器件(SMD)的湿气敏感度等级。
Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.
吸热和封装,
垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.
It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.
用于将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的焊料球质量较小,加上封装体较薄,热量传送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Melting seal packaging,a transparent window makes the sorbent seeable.
融合装,可以通过透明窗观察吸附剂的状态。
Pavier M.Standing P.Cutler A.Sawle C.Blake A.
用小型散热器对DirectFET装功率MOSFET进行双面散热(M.
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部装中的压焊工艺进行了参数优化设计。
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
本标准用装的表面安装器件(SMD)的湿
敏感度等级。
Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.
吸热和装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.
It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.
用将
装完毕的液体内酯豆腐加热成型及巴氏灭菌。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由微型
装器件上的焊料球质量较小,加上
装体较薄,热量传送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Melting seal packaging,a transparent window makes the sorbent seeable.
融合封装,可以通过透明窗观察吸附剂的状态。
Pavier M.Standing P.Cutler A.Sawle C.Blake A.
用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
本标准用于确定气密封装的表面安装器件(SMD)的湿气敏感度等级。
Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.
吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.
It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.
用于将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的焊量较小,加上封装体较薄,热量传送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Melting seal packaging,a transparent window makes the sorbent seeable.
融合封装,可以通过透明窗观察吸附剂状态。
Pavier M.Standing P.Cutler A.Sawle C.Blake A.
用小型散热器对DirectFET封装功率MOSFET进散热(M.
Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验方法对肖特基器件后部封装中
压焊工艺进
了参数优化设计。
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
本标准用于确定气密封装
表
安装器件(SMD)
湿气敏感度等级。
Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.
吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少,
, 未电镀引线.
It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.
用于将封装完毕液体内酯豆腐加热成型及巴氏灭菌。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上焊料球质量较小,加上封装体较薄,热量传送通过器件速度很快。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件观点;若发现问题,欢迎向我们指正。