Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂体,间
胺和
氨
甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂体,间
胺和
氨
甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点
化剂,铜粉
导电填料,制备
化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
氧树脂
基体,间苯二胺和二氨基二苯甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:上例句、词性分类均由互联
自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂体,间
胺和
氨
甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融
物
剂,铜粉
导电填料,制备了
各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合
化剂,铜粉
导电填料,
热
化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间
二胺和二氨基二
的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性类均由互联网资源自动生成,
经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物
固
,
粉
导
,制备了热固
各向同性导
胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物
固
,
粉
导
,制备了热固
各向同性导
胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。