I endeavoured to unhasp the casement，but the hook was soldered into the staple.

我试着去打开那窗子，但窗钩给在钩环里了。

Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，高转移的效率与孔面积比率及它对回流峰共面度的影响。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型件上的球质量较小，加上体较薄，热量传送通过件速度很快。

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板的生产过程中,会产生外观不整洁、阻不均匀、文字偏移、线路及盘破损等缺陷。

I endeavoured to unhasp the casement，but the hook was soldered into the staple.

我试着去打开那窗子，但窗钩给在钩环里了。

Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，高转移的效率与孔面积比率及它对回流峰共面度的影响。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板的生产过程中,会产生外观不整洁、阻不均匀、文字偏移、线路及盘破损等缺陷。

I endeavoured to unhasp the casement，but the hook was soldered into the staple.

我试着去打开，但钩给焊在钩环里了。

Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，高转移的效率与孔面积比率及它对回流峰共面度的影响。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装件上的焊料球质量较小，加上封装体较薄，热量传送通过件速度很快。

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板的生产过程中,会产生外观不整洁、阻焊不均匀、文字偏移、线路及焊盘破损等缺陷。

I endeavoured to unhasp the casement，but the hook was soldered into the staple.

我试着去打开那窗子，但窗钩给在钩环里了。

Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，高转移的效面积比及它对回流峰共面度的影响。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板的生产过程中,会产生外观不整洁、阻不均匀、文字偏移、线路及盘破损等缺陷。

I endeavoured to unhasp the casement，but the hook was soldered into the staple.

我试着去打开那窗子，但窗钩给在钩环里了。

Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，高转移的效率与孔面积比率及它对回流峰共面度的影响。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板的生产过程中,会产生外观不整洁、阻不均匀、文字偏移、线路及盘破损等缺陷。

I endeavoured to unhasp the casement，but the hook was soldered into the staple.

我试着去打开那窗子，但窗钩给焊在钩环里了。

Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，高转移的效率与孔面积比率及它对回流峰共面度的影响。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊量较小，加上封装体较薄，热量传送通过器件速度很快。

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板的生产过程中,会产生外观不整洁、阻焊不均匀、文字偏移、线路及焊盘破损等缺陷。

I endeavoured to unhasp the casement，but the hook was soldered into the staple.

我试着去打开那窗子，但窗钩给在钩环里了。

Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，高转移效率与孔面积比率及它对回流峰共面度影响。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件料球质量较小，加封装体较薄，热量传送通过器件速度很快。

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板生产过程中,会产生外观不整洁、阻不均匀、文字偏移、线路及盘破损等缺陷。

I endeavoured to unhasp the casement，but the hook was soldered into the staple.

我试着去打开那窗子，但窗钩给在钩环里了。

Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，高转移的效率与孔面积比率及它对回流峰共面度的影响。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板的生产过程中,会产生外观不整洁、阻不均匀、文字偏移、线路及盘破损等缺陷。

I endeavoured to unhasp the casement，but the hook was soldered into the staple.

我试着去打开那窗子，但窗钩给在钩环里了。

Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，高转移的效率与孔面积比率及它对回流峰共面度的影响。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的球质量较小，加上封装体较薄，热量传送通过器件速度很快。

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板的生产过程中,会产生外观不整洁、阻不均匀、文字偏移、线路及盘破损等缺陷。