Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

渗锌作为上世纪初发展起来的一项金属表面处理技术,其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金层是镀锡后在加熔融处理过程中通过在基板与锡层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上发展起来的一项金属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

锡板合金是锡后在加熔融处理过程中通过扩散在基板与锡之间生成的一种金属间化合物,因此,合金的生成与原板和有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属表面理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金层是镀锡理过程中通过扩散基板与锡层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

渗锌作为上世纪初发展起来的一项金属表面处理技术,其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金层是镀锡后在加熔融处理过程中通过在基板与锡层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

锌作为上世纪初发展起来的一项金属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金层是镀锡后在加熔融处理过程中通过在基板与锡层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属表面处技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

板合金层后在加熔融处中通扩散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起项金属表面处理技术,以其良好耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金层是镀锡后在加熔融处理过程中通过扩散在基板锡层之间种金属间化合物,因此,合金层原板和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属表面处理技术,以其良好的耐腐蚀到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金是镀锡后在加熔融处理过程中通过扩散在基板与锡生成的一种金属化合物,因此,合金的生成与原板和镀都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属表面处技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

板合金层后在加熔融处中通扩散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和层都有很大关系。