The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性导电胶及其制备法。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性导电胶及其制备法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同性相差很大情况往往产生于层理,片理,某些时候则由于断裂所
。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
为它可以
出一个简
程,在各向同性
情况下,这个简
程是一个双位势
程。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为基体,间苯二胺和二氨基二苯甲烷低融点混合物为固化剂,铜粉为导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生,部分未经过人工审核,其表达内容亦不代表本软件
观点;若发现问题,欢迎向我们指正。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性及其制备方法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同性相差很大的情况往往产生于层理,片理,某些时候则由于断裂所造成。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
因为它可以出一个简单的方程,在各向同性的情况下,这个简单方程是一个双位势方程。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为体,间苯
胺和
苯甲烷的低融点混合物为固化剂,铜粉为
填料,制备了热固化各向同性
。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性及其制备方法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同性相差很大的情况往往产生于层理,片理,某些时候则由于断裂所造成。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
因为它可以出一个简单的方程,在各向同性的情况下,这个简单方程是一个双位势方程。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为体,间苯
胺和
苯甲烷的低融点混合物为固化剂,铜粉为
填料,制备了热固化各向同性
。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性导电胶及其制备方法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同性相差很大的情况往往产生于层,
,
些时候则由于断裂所造成。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
因为它可以出一
简单的方程,在各向同性的情况
,
简单方程是一
双位势方程。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为基体,间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂,铜粉为导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性导电胶及其制备方法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同性相差很大的情况往往产生于层理,片理,某些时候则由于断裂所造成。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
因为它可以出一个简单的方程,在各向同性的情况下,这个简单方程是一个双位势方程。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为基体,间苯二胺和二氨基二苯甲烷的低融点混合物为固化,
为导电填料,制备了热固化各向同性导电胶。
声明:以上、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种各向同性导电胶及其制备方法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同性相差很大情况往往产生于层理,片理,某些时候则由于断裂所造成。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
因为它可以出一个简单
方程,在各向同性
情况下,这个简单方程是一个双位势方程。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为基体,间苯二胺和二氨基二苯甲烷点混合物为
剂,铜粉为导电填料,制备了
各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件观点;若发现问题,欢迎向我们指正。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性导电胶及其方法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同性相差很大的情况往往产生于层理,片理,某些时候则由于断裂所造成。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
因为它可以出一个简单的方程,在各向同性的情况下,这个简单方程是一个双位势方程。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为基体,间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂,铜粉为导电填料,热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同胶及其制备方法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同相差很大的情况往往产生于层理,片理,某些时候则由于断裂所造成。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
因为它可以出一个简单的方程,在各向同
的情况下,这个简单方程是一个双位势方程。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为体,间苯
胺和
苯甲烷的低融点混合物为固化剂,铜粉为
填料,制备了热固化各向同
胶。
声明:以上例句、词分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.
本发明涉及一种热固化各向同性导电胶及其制备方法。
Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.
与各向同性相差很大的情况往往产生于层理,片理,某些时候则由于断裂所造成。
It leads to one simple equation, which, in the isotropic case, is the bipotential equation .
可以
出一
的方程,在各向同性的情况下,这
方程是一
双位势方程。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物
固化剂,铜粉
导电填料,制备了热固化各向同性导电胶。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。