And the fact that it was always on reduced the thermal cycling of the filament and components limiting the stress caused by thermal expansion and contraction.
36. Question: In PCBA, what does the term " solder joint fatigue" mean? Answer: It refers to the weakening and eventual failure of solder joints due to repeated thermal cycling or mechanical stress.
It requires a thermal cycler, filled with the DNA sample to be multiplied, thermostable Taq polymerase, primers with which we select what gets multiplied, and free nucleotides of all 4 types - A, T, C and G.