A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在程中,因BGA锡球内
隙有气体溢出
吹
.
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46. Question: In PCBA, why is it important to control the reflow soldering profile accurately? Answer: An inaccurate profile can lead to issues like insufficient solder joint formation, component damage due to overheating, or uneven soldering.
46. 问题:在 PCBA ,为什么准确控制
焊曲线
要?答案:不准确的配置文件会导致焊点形成不足、过热导致组件损坏或焊接不均匀等问题。