1.To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.
为保护焊的功率器件设计了过压欠压电路。
2.These newly-designed devices will appear on the exhibition next month.
这些新设计的器件将在下月的展览会上展出。
3.B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.
《微波铁氧体线性器件原理》,科学出版社,北京,1979。
4.Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.
对毫米波器件在惰性气体保护下的接触反应钎焊进行了研究。
5.A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.
摘要提出了一种基于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型。
6.The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.
本文对rubrene单掺杂层的有白器件的性能和理进行了研究。
7.Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对特基器件后部封装中的压焊工艺进行了化设计。
8.The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.
摘要悬臂梁的物理性能尤其是弹性系对MEMS中微器件的性能有着重要的影响。
9.This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.
本标准用于确定非气密封装的表面安装器件(SMD)的湿气敏感度等级。
10.The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.
结果表明,通过适当的改性,PET材料可用来生产电子连接器、线圈骨架、点火元件等电子、电气元器件。
11.In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.
12.Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.
重点研究了退化PMOS器件的高场退火效应和氧化层陷阱电子的退陷阱制。
13.An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.
从体硅CMOS器件的闭锁效应入手,提出了抑制闭锁的一种新方法—伪闭锁路径法。
14.The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的焊料球质量较小,加上封装体较薄,热量传送通过器件速度很快。
15.Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.
ZC25型绝缘电阻表可用于测量各种电、电讯元器件、家用电器及教学电器设备的绝缘电阻。
16.Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.
目前,国际上有双极性晶体管的研究由于受到种种限制性能并不理想,很少能获得对称性良好的高性能器件。
17.This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.
18.In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.
19.The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.
激基复合物通常波长较长且半峰宽较宽,因此利用激基复合物是制备有白电器件的有效方法。
20.Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.