封装

Melting seal packaging,a transparent window makes the sorbent seeable.

融合装，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

小型散热DirectFET装功率MOSFET进行双面散热(M.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后正交试验的方法肖特基件后部装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准于确定气密装的表面安装件（SMD）的湿气敏感度等级。

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀.

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

于将装完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型装件上的焊料球质量较小，加上装体较薄，热量传送通过件速度很快。