各向同性

The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.

本发明涉及一种热固化各向同导电胶及其制备方法。

Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.

与各向同相差很大况往往产生于层理，片理，某些由于断裂所造成。

It leads to one simple equation, which, in the isotropic case, is the bipotential equation .

因为它可以出一个简单方程，在各向同况下，这个简单方程是一个双位势方程。

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂为基体,间苯二胺和二氨基二苯甲烷低融点混合物为固化剂,铜粉为导电填料,制备了热固化各向同导电胶。