Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5，锡高转移
效率与孔面积比率及它对回流峰共面
响。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5，锡高转移效率与孔面积比率及它对回流峰共面响。
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