Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产所用的氟硼酸盐镀
液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀
后在加热熔融处理过
过热扩散在基板与
层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀
后在加热熔融处理过程中通过热扩散在基板与
层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
声明:以、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀
后在加热熔融处理过程中通过热扩散在基板与
层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
声明:句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀
后在加热熔融处理过程中通过热扩散在基板与
层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
:
上
句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或
层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主印制线路板生产中所用的氟硼酸盐镀
铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合
层是镀
后在加热熔融处理过程中通过热扩散在基板与
层之间生成的一
间化合物,因此,合
层的生成与原板和镀层都有很大关系。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之
的
。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
要论述印制线路板生产中所用的氟硼酸盐镀
铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板
金层是镀
后在加热熔融处理过程中通过热扩散在基板与
层之
生成的一种金属
物,因此,
金层的生成与原板和镀层都有很大关系。
声明:以上例句、词性分类均由互联网资源自生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀
后在加热熔融处理过程中通过热扩散在基板与
层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
声明:以上、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止在镀或金层与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟镀
铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合金层是镀
后在加
熔融处理过程中通过
在基板与
层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。
Nickel underplating prevents the migration between tin or gold platings and the base material.
垫板镀镍可防止镀
或
与基料之间的移动。
Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.
主要论述印制线路板生产中所用的氟硼酸盐镀铅溶液。
The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.
镀板合
镀
后
熔融处理过程中通过
扩散
基板与
之间生成的一种
属间化合物,因此,合
的生成与原板和镀
都有很大关系。
声明:以上例句、词性分类均由互联网资源自动生成,部分未经过人工审核,其表达内容亦不代表本软件的观点;若发现问题,欢迎向我们指正。