To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.

为保护焊机的功率器件设计过压欠压电路。

These newly-designed devices will appear on the exhibition next month.

这些新设计的器件将在下月的展览会上展出。

B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.

《微波铁氧体线性器件原理》，科学出版社，北京，1979。

Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.

对毫米波器件在惰性气体保护下的接触反应钎焊究。

A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.

摘要提出一种基于二维器件模拟的深亚微米外延型衬底的电阻宏模型。

The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.

本文对rubrene单掺杂层的有机白光器件的性能和发光机理究。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对特基器件后部封装中的压焊参数优化设计。

The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.

摘要悬臂梁的物理性能参数尤其是弹性系数对MEMS中微器件的性能有着重要的影响。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。

The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.

结果表明,通过适当的改性,PET材料可用来生产电子连接器、线圈骨架、点火元件等电子、电气元器件。

In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.

请问如何有选择性的更改，如，我只要改一个焊盘，或者我只要改一个器件 A:padstack--replace里可以改一个盘，或一个元件，或一类器件， 25.

Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.

重点究退化PMOS器件的高场退火效应和氧化层陷阱电子的退陷阱机制。

An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.

从体硅CMOS器件的闭锁效应入手,提出抑制闭锁的一种新方法—伪闭锁路径法。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.

ZC25型绝缘电阻表可用于测量各种电机、电讯元器件、家用电器及教学电器设备的绝缘电阻。

Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.

目前，国际上有机双极性晶体管的究由于受到种种限制性能并不理想，很少能获得对称性良好的高性能器件。

This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.

利用这一特性可以究晶体管结温分布的不均匀性，计算结温分布的不均匀度，对半导体器件可靠性分析具有重要的意义。

In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.

自从1987年C.W.Tang等人报道以8-羟基喹啉铝（Alq3）为发光层制备的高亮度电致发光器件以来，有机金属配合物发光材料及其器件加成为有机电致发光领域的一个究热点。

The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.

激基复合物发光通常波长较长且半峰宽较宽，因此利用激基复合物发光是制备有机白光电发光器件的有效方法。

Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.

由此提出双光纤链路与IP插空联合的光突发交换解决方案，以缓解光子器件瓶颈的限制。

To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.

为保护焊机的功率器件设计了过压欠压电路。

These newly-designed devices will appear on the exhibition next month.

这些新设计的器件将在下月的展览会上展出。

B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.

《微波铁氧体线性器件原理》，科学出版社，北京，1979。

Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.

对毫米波器件在惰性体保护下的接触焊进行了研究。

A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.

摘要提出了一种基于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型。

The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.

本文对rubrene单掺杂层的有机白光器件的性能和发光机理进行了研究。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对特基器件后部封装中的压焊工艺进行了参数优化设计。

The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.

摘要悬臂梁的物理性能参数尤其是弹性系数对MEMS中微器件的性能有着重要的影响。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非密封装的表面安装器件（SMD）的感度等级。

The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.

结果表明,通过适当的改性,PET材料可用来生产电子连接器、线圈骨架、点火元件等电子、电元器件。

In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.

请问如何有选择性的更改，如，我只要改一个焊盘，或者我只要改一个器件 A:padstack--replace里可以改一个盘，或一个元件，或一类器件， 25.

Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.

重点研究了退化PMOS器件的高场退火效和氧化层陷阱电子的退陷阱机制。

An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.

从体硅CMOS器件的闭锁效入手,提出了抑制闭锁的一种新方法—伪闭锁路径法。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.

ZC25型绝缘电阻表可用于测量各种电机、电讯元器件、家用电器及教学电器设备的绝缘电阻。

Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.

目前，国际上有机双极性晶体管的研究由于受到种种限制性能并不理想，很少能获得对称性良好的高性能器件。

This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.

利用这一特性可以研究晶体管结温分布的不均匀性，计算结温分布的不均匀度，对半导体器件可靠性分析具有重要的意义。

In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.

自从1987年C.W.Tang等人报道了以8-羟基喹啉铝（Alq3）为发光层制备的高亮度电致发光器件以来，有机金属配合物发光材料及其器件加工工艺成为有机电致发光领域的一个研究热点。

The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.

激基复合物发光通常波长较长且半峰宽较宽，因此利用激基复合物发光是制备有机白光电发光器件的有效方法。

Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.

由此提出了双光纤链路与IP插空联合的光突发交换解决方案，以缓解光子器件瓶颈的限制。

To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.

为保护焊机的功率器件设计了过压欠压电路。

These newly-designed devices will appear on the exhibition next month.

这些新设计的器件将在下月的展览会上展出。

B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.

《微波铁氧体线性器件原理》，科学出版社，北京，1979。

Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.

对毫米波器件在惰性气体保护下的接触反应钎焊进行了研究。

A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.

摘要提出了种基于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型。

The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.

本文对rubrene单掺杂层的有机白光器件的性能和发光机理进行了研究。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对特基器件后部封装中的压焊工艺进行了参数优化设计。

The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.

摘要悬臂梁的物理性能参数尤其是弹性系数对MEMS中微器件的性能有着重要的影响。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。

The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.

结果表明,通过适当的改性,PET材料可用来生产电子连接器、线圈骨架、点火元件等电子、电气元器件。

In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.

请问如何有选择性的更改，如，我只要改焊盘，者我只要改器件 A:padstack--replace里可以改盘，元件，类器件， 25.

Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.

重点研究了退化PMOS器件的高场退火效应和氧化层陷阱电子的退陷阱机制。

An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.

从体硅CMOS器件的闭锁效应入手,提出了抑制闭锁的种新方法—伪闭锁路径法。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.

ZC25型绝缘电阻表可用于测量各种电机、电讯元器件、家用电器及教学电器设备的绝缘电阻。

Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.

目前，国际上有机双极性晶体管的研究由于受到种种限制性能并不理想，很少能获得对称性良好的高性能器件。

This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.

利用这特性可以研究晶体管结温分布的不均匀性，计算结温分布的不均匀度，对半导体器件可靠性分析具有重要的意义。

In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.

自从1987年C.W.Tang等人报道了以8-羟基喹啉铝（Alq3）为发光层制备的高亮度电致发光器件以来，有机金属配合物发光材料及其器件加工工艺成为有机电致发光领域的研究热点。

The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.

激基复合物发光通常波长较长且半峰宽较宽，因此利用激基复合物发光是制备有机白光电发光器件的有效方法。

Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.

由此提出了双光纤链路与IP插空联合的光突发交换解决方案，以缓解光子器件瓶颈的限制。

To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.

为保护焊机的功率器件设计了过压欠压电路。

These newly-designed devices will appear on the exhibition next month.

这些新设计的器件将在下月的展览会上展出。

B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.

《微波铁氧体线性器件原理》，科学出版社，北京，1979。

Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.

对毫米波器件在惰性气体保护下的接触反应钎焊进行了研究。

A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.

摘要提出了一种基于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型。

The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.

本文对rubrene单掺杂层的有机白光器件的性能和发光机理进行了研究。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最用正的方法对特基器件装中的压焊工艺进行了参数优化设计。

The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.

摘要悬臂梁的物理性能参数尤其是弹性系数对MEMS中微器件的性能有着重要的影响。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密装的表面安装器件（SMD）的湿气敏感度等级。

The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.

结果表明,通过适当的改性,PET材料可用来生产电子连接器、线圈骨架、点火元件等电子、电气元器件。

In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.

请问如何有选择性的更改，如，我只要改一个焊盘，或者我只要改一个器件 A:padstack--replace里可以改一个盘，或一个元件，或一类器件， 25.

Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.

重点研究了退化PMOS器件的高场退火效应和氧化层陷阱电子的退陷阱机制。

An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.

从体硅CMOS器件的闭锁效应入手,提出了抑制闭锁的一种新方法—伪闭锁路径法。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型装器件上的焊料球质量较小，加上装体较薄，热量传送通过器件速度很快。

Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.

ZC25型绝缘电阻表可用于测量各种电机、电讯元器件、家用电器及教学电器设备的绝缘电阻。

Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.

目前，国际上有机双极性晶体管的研究由于受到种种限制性能并不理想，很少能获得对称性良好的高性能器件。

This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.

利用这一特性可以研究晶体管结温分布的不均匀性，计算结温分布的不均匀度，对半导体器件可靠性分析具有重要的意义。

In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.

自从1987年C.W.Tang等人报道了以8-羟基喹啉铝（Alq3）为发光层制备的高亮度电致发光器件以来，有机金属配合物发光材料及其器件加工工艺成为有机电致发光领域的一个研究热点。

The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.

激基复合物发光通常波长较长且半峰宽较宽，因此利用激基复合物发光是制备有机白光电发光器件的有效方法。

Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.

由此提出了双光纤链路与IP插空联合的光突发换解决方案，以缓解光子器件瓶颈的限制。

To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.

为保护焊机的功率器件设计过压欠压电路。

These newly-designed devices will appear on the exhibition next month.

这些新设计的器件将在下月的展览会上展。

B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.

《微波铁氧体线性器件原理》，科学版社，北京，1979。

Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.

对毫米波器件在惰性气体保护下的接触反应钎焊进行研究。

A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.

摘要一种基于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型。

The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.

本文对rubrene单掺杂层的有机白光器件的性能和发光机理进行研究。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对特基器件后部中的压焊工艺进行参数优化设计。

The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.

摘要悬臂梁的物理性能参数尤其是弹性系数对MEMS中微器件的性能有着重要的影响。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气的表面安器件（SMD）的湿气敏感度等级。

The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.

结果表明,通过适当的改性,PET材料可用来生产电子连接器、线圈骨架、点火元件等电子、电气元器件。

In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.

请问如何有选择性的更改，如，我只要改一个焊盘，或者我只要改一个器件 A:padstack--replace里可以改一个盘，或一个元件，或一类器件， 25.

Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.

重点研究退化PMOS器件的高场退火效应和氧化层陷阱电子的退陷阱机制。

An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.

从体硅CMOS器件的闭锁效应入手,抑制闭锁的一种新方法—伪闭锁路径法。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型器件上的焊料球质量较小，加上体较薄，热量传送通过器件速度很快。

Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.

ZC25型绝缘电阻表可用于测量各种电机、电讯元器件、家用电器及教学电器设备的绝缘电阻。

Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.

目前，国际上有机双极性晶体管的研究由于受到种种限制性能并不理想，很少能获得对称性良好的高性能器件。

This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.

利用这一特性可以研究晶体管结温分布的不均匀性，计算结温分布的不均匀度，对半导体器件可靠性分析具有重要的意义。

In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.

自从1987年C.W.Tang等人报道以8-羟基喹啉铝（Alq3）为发光层制备的高亮度电致发光器件以来，有机金属配合物发光材料及其器件加工工艺成为有机电致发光领域的一个研究热点。

The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.

激基复合物发光通常波长较长且半峰宽较宽，因此利用激基复合物发光是制备有机白光电发光器件的有效方法。

Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.

由此双光纤链路与IP插空联合的光突发交换解决方案，以缓解光子器件瓶颈的限制。

To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.

为保护焊机的功率器件设计了过压欠压电路。

These newly-designed devices will appear on the exhibition next month.

这些新设计的器件将在下月的展览会上展出。

B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.

《微波铁氧体线器件原理》，科学出版社，北京，1979。

Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.

对毫米波器件在惰气体保护下的接触反应钎焊进行了研究。

A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.

摘要提出了一种基于二维器件拟的深亚微米工艺外延衬底的电阻宏。

The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.

文对rubrene单掺杂层的有机白光器件的能和发光机理进行了研究。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对特基器件后部封装中的压焊工艺进行了参数优化设计。

The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.

摘要悬臂梁的物理能参数尤其系数对MEMS中微器件的能有着重要的影响。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。

The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.

结果表明,通过适当的改,PET材料可用来生产电子连接器、线圈骨架、点火元件等电子、电气元器件。

In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.

请问如何有选择的更改，如，我只要改一个焊盘，或者我只要改一个器件 A:padstack--replace里可以改一个盘，或一个元件，或一类器件， 25.

Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.

重点研究了退化PMOS器件的高场退火效应和氧化层陷阱电子的退陷阱机制。

An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.

从体硅CMOS器件的闭锁效应入手,提出了抑制闭锁的一种新方法—伪闭锁路径法。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.

ZC25绝缘电阻表可用于测量各种电机、电讯元器件、家用电器及教学电器设备的绝缘电阻。

Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.

目前，国际上有机双极晶体管的研究由于受到种种限制能并不理想，很少能获得对称良好的高能器件。

This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.

利用这一特可以研究晶体管结温分布的不均匀，计算结温分布的不均匀度，对半导体器件可靠分析具有重要的意义。

In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.

自从1987年C.W.Tang等人报道了以8-羟基喹啉铝（Alq3）为发光层制备的高亮度电致发光器件以来，有机金属配合物发光材料及其器件加工工艺成为有机电致发光领域的一个研究热点。

The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.

激基复合物发光通常波长较长且半峰宽较宽，因此利用激基复合物发光制备有机白光电发光器件的有效方法。

Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.

由此提出了双光纤链路与IP插空联合的光突发交换解决方案，以缓解光子器件瓶颈的限制。

To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.

为保护焊机的功率器件设计了过压欠压电路。

These newly-designed devices will appear on the exhibition next month.

这些新设计的器件将在下月的展览会上展出。

B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.

《微波铁氧体线性器件原理》，科学出版社，北京，1979。

Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.

对毫米波器件在惰性体保护下的接触反应钎焊进行了研究。

A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.

摘要提出了于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型。

The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.

本文对rubrene单掺杂层的有机白光器件的性能和发光机理进行了研究。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对特器件后部封装中的压焊工艺进行了参数优化设计。

The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.

摘要悬臂梁的物理性能参数尤其是弹性系数对MEMS中微器件的性能有着重要的影响。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确密封装的表面安装器件（SMD）的湿敏感度等级。

The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.

结果表明,通过适当的改性,PET材料可用来生产电子连接器、线圈骨架、点火元件等电子、电元器件。

In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.

请问如何有选择性的更改，如，我只要改个焊盘，或者我只要改个器件 A:padstack--replace里可以改个盘，或个元件，或类器件， 25.

Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.

重点研究了退化PMOS器件的高场退火效应和氧化层陷阱电子的退陷阱机制。

An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.

从体硅CMOS器件的闭锁效应入手,提出了抑制闭锁的新方法—伪闭锁路径法。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.

ZC25型绝缘电阻表可用于测量各电机、电讯元器件、家用电器及教学电器设备的绝缘电阻。

Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.

目前，国际上有机双极性晶体管的研究由于受到限制性能并不理想，很少能获得对称性良好的高性能器件。

This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.

利用这特性可以研究晶体管结温分布的不均匀性，计算结温分布的不均匀度，对半导体器件可靠性分析具有重要的意义。

In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.

自从1987年C.W.Tang等人报道了以8-羟喹啉铝（Alq3）为发光层制备的高亮度电致发光器件以来，有机金属配合物发光材料及其器件加工工艺成为有机电致发光领域的个研究热点。

The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.

激复合物发光通常波长较长且半峰宽较宽，因此利用激复合物发光是制备有机白光电发光器件的有效方法。

Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.

由此提出了双光纤链路与IP插空联合的光突发交换解决方案，以缓解光子器件瓶颈的限制。

To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.

为保护焊机功率器件设计了过压欠压电路。

These newly-designed devices will appear on the exhibition next month.

这些新设计器件将在月展览会上展出。

B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.

《微波铁氧体线性器件原理》，科学出版社，北京，1979。

Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.

对毫米波器件在惰性气体保护触反应钎焊进行了研究。

A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.

摘要提出了一种基于二维器件模拟深亚微米工艺外延型衬底电阻宏模型。

The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.

本文对rubrene单掺杂层有机白光器件性能和发光机理进行了研究。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验方法对特基器件后部封装中压焊工艺进行了参数优化设计。

The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.

摘要悬臂梁物理性能参数尤其是弹性系数对MEMS中微器件性能有着重要影响。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装表面安装器件（SMD）湿气敏感。

The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.

结果表明,通过适当改性,PET材料可用来生产电子连器、线圈骨架、点火元件电子、电气元器件。

In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.

请问如何有选择性更改，如，我只要改一个焊盘，或者我只要改一个器件 A:padstack--replace里可以改一个盘，或一个元件，或一类器件， 25.

Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.

重点研究了退化PMOS器件高场退火效应和氧化层陷阱电子退陷阱机制。

An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.

从体硅CMOS器件闭锁效应入手,提出了抑制闭锁一种新方法—伪闭锁路径法。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上焊料球质量较小，加上封装体较薄，热量传送通过器件速很快。

Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.

ZC25型绝缘电阻表可用于测量各种电机、电讯元器件、家用电器及教学电器设备绝缘电阻。

Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.

目前，国际上有机双极性晶体管研究由于受到种种限制性能并不理想，很少能获得对称性良好高性能器件。

This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.

利用这一特性可以研究晶体管结温分布不均匀性，计算结温分布不均匀，对半导体器件可靠性分析具有重要意义。

In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.

自从1987年C.W.Tang人报道了以8-羟基喹啉铝（Alq3）为发光层制备高亮电致发光器件以来，有机金属配合物发光材料及其器件加工工艺成为有机电致发光领域一个研究热点。

The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.

激基复合物发光通常波长较长且半峰宽较宽，因此利用激基复合物发光是制备有机白光电发光器件有效方法。

Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.

由此提出了双光纤链路与IP插空联合光突发交换解决方案，以缓解光子器件瓶颈限制。

To protect the power component of electric welding machine,overtension and undertension protection are circuit designed.

为保护焊机的功率器件设计了过压欠压路。

These newly-designed devices will appear on the exhibition next month.

这些新设计的器件将在下月的展览会上展出。

B.Lax and K.J.Button, Microwave Ferrites and Ferrimagnetics,McGraw-Hill,New York,1962.

《微波铁氧体线性器件原》，出版社，北京，1979。

Contact reaction brazing(CRB) for milimetre waveguide in inert atmosphere has been investigated.

对毫米波器件在惰性气体保护下的接触反应钎焊进行了研究。

A resistance macromodel for deep-submicron process epi-type substrate based on the 2D device simulation is presented.

摘要提出了一种基于二维器件模拟的深亚微米工艺外延型衬底的阻宏模型。

The mechanism of incomplete energy transfer and directly carriers capture by rubrene was existed in this WOLED simultaneously.

本文对rubrene单掺杂层的有机白光器件的性能和发光机进行了研究。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对特基器件后部封装中的压焊工艺进行了参数优化设计。

The physical properities of cantilever, in particular the spring constant has important influence on the microcomponent of MEMS.

摘要悬臂梁的物性能参数尤其是弹性系数对MEMS中微器件的性能有着重要的影响。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。

The investigation showed that after modified PET could be used in electronic junctor, coiler framework, igniting parts.

结果表明,通过适当的改性,PET材料可用来生产接器、线圈骨架、点火元件等、气元器件。

In cct, you can use post-route, spread wire and center wire.In allegro, you can use roue-glosss-parameter-ceneter lines between pads. 24.

请问如何有选择性的更改，如，我只要改一个焊盘，或者我只要改一个器件 A:padstack--replace里可以改一个盘，或一个元件，或一类器件， 25.

Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.

重点研究了退化PMOS器件的高场退火效应和氧化层陷阱的退陷阱机制。

An innovation for prevention latchup,pseudo-latchup path method,has been put forward that is based on latchup effects of bulk-Si CMOS devices.

从体硅CMOS器件的闭锁效应入手,提出了抑制闭锁的一种新方法—伪闭锁路径法。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Insulance Ohmmeter, Model ZC25, can be used to measure insulation resistance of various electrical machinery, telecommunication element, household appliances and teaching electrical equipment.

ZC25型绝缘阻表可用于测量各种机、讯元器件、家用器及教器设备的绝缘阻。

Ambipolar transistors are attractive for realizing complementary-like organic integrated circuits, which operate with low power dissipation, wide noise margins and great operational stability.

目前，国际上有机双极性晶体管的研究由于受到种种限制性能并不想，很少能获得对称性良好的高性能器件。

This phenomenon is called the excessive thermotaxis effect of low current.Based on these characteristics, the uniformity of the junction temperature distribution is studied.

利用这一特性可以研究晶体管结温分布的不均匀性，计算结温分布的不均匀度，对半导体器件可靠性分析具有重要的意义。

In the first part of this paper, three new ligands with bis(8-hydroxyquinoline) which were substituted by methoxy, butoxy and octoxy were synthesized by Witting-Horner reaction.

自从1987年C.W.Tang等人报道了以8-羟基喹啉铝（Alq3）为发光层制备的高亮度致发光器件以来，有机金属配合物发光材料及其器件加工工艺成为有机致发光领域的一个研究热点。

The white light comes from exciplex emission at the solid-state interface between (dppy)BF and NPB in addition to the exiton emission from NPB and (dppy)BF respectively.

激基复合物发光通常波长较长且半峰宽较宽，因此利用激基复合物发光是制备有机白光发光器件的有效方法。

Based on the server-based optical network architecture, the dual fiber link and IP calking for Optical Burst Switching (OBS) are proposed to abate the restriction of optical devices.

由此提出了双光纤链路与IP插空联合的光突发交换解决方案，以缓解光器件瓶颈的限制。